This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture energy and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this standard.
Equipment Required
By means of our testing expertise and modular product design, we will help find the solution that is right for you. Give our test engineers a call today for help configuring the best test machine and accessories according to your standard.
Recommended Test Machine
Forces up to 10 kN (2,250 lbf)
Low force tabletop systems
Modular series of five frame options with adjustable test space
Affordable testing option for tension, compression, bend, peel and much more
Forces up to 5 kN (1,125 lbf)
Low force tabletop systems
Tests at speeds up to 2,500 mm/min (100 in/min)
Best for high travel or high elongation test requirements
Force range of 5 kN to 600 kN (1,125 lbf to 135,000 lbf)
Adjustable test space
The most popular choice for static tension and compression tests
These dual column testers are available in both tabletop and floor standing models
