B115A

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

Equipment Required

By means of our testing expertise and modular product design, we will help find the solution that is right for you. Give our test engineers a call today for help configuring the best test machine and accessories according to your standard.

Recommended Test Machine