The pin pull test is performed on printed circuit boards by subjecting a solder pin to a tensile force until failure occurs. This measures the adhesion strength of the solder pin to the pad and the pad to the laminate. The miniature size pins are closely arranged in an array and the fixtures selected must ensure that the pins are not damaged prior to or during clamping.
Recommended Test Machine
100 Series Universal Test Machines
Forces up to 10 kN (2,250 lbf)
Low force tabletop systems
Modular series of five frame options with adjustable test space
Affordable testing option for tension, compression, bend, peel and much more